Sr Process Engineer (Wire Bond, Die Bond)

Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond & Die Bonding.

Key Responsibilities:

• Lead and manage the wire bonding and die bonding processes, ensuring high-quality output and process efficiency.
• Develop and optimize manufacturing processes for wire bonding and die bonding applications to meet production and quality targets.
• Provide technical expertise and troubleshooting support for wire bonding and die bonding issues.
• Work closely with cross-functional teams to implement process improvements, reduce costs, and enhance product performance.
• Drive continuous improvement initiatives, including yield enhancement and cycle time reduction.
• Prepare and maintain documentation related to processes, materials, and equipment qualifications.
• Collaborate with suppliers and equipment vendors to ensure proper maintenance, upgrades, and troubleshooting of bonding equipment.
• Mentor and train junior engineers and technicians, fostering a culture of technical excellence.

Skills & Experience Required:

• Bachelor's or Master's degree in Engineering (Electrical, Mechanical, Materials Science, or related field).
• Minimum of 7 years of experience in wire bond and die bonding processes within a semiconductor manufacturing environment.
• Extensive hands-on experience with epoxy die attach processes, particularly with 8-inch to 12-inch wafers.
• Strong understanding of semiconductor materials, processes, and equipment.
• Proven track record in troubleshooting and resolving complex process challenges.
• Familiarity with advanced packaging technologies and trends.
• Excellent problem-solving, analytical, and communication skills.
• Ability to lead projects and work effectively in a collaborative team environment.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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