Operations Manager

Our client is a rapidly expanding semiconductor company in Malacca. They are currently looking to hire an Operations Manager who would handle the Wire Bond and Die Bond sections.

Key Responsibilities:

• Operational Oversight: Lead and manage the wire bond and die bond departments, ensuring smooth production operations, meeting output targets, and maintaining product quality standards.
• Process Optimization: Identify areas for improvement within the wire bond and die bond processes, implement process optimization techniques, and utilize lean manufacturing methodologies to enhance productivity and reduce
• Quality Assurance: Work closely with the Quality Assurance team to monitor and uphold strict quality control measures, ensuring all processes meet internal and industry
• Team Leadership: Supervise, train, and mentor a team of technicians and operators, fostering a collaborative and high-performance work Conduct performance evaluations and address skill gaps through targeted development plans.
• Production Planning: Coordinate with the production planning team to establish schedules that optimize equipment utilization and align with inventory requirements and customer demand.
• Equipment Management: Oversee the maintenance and troubleshooting of wire bond and die bond equipment, coordinating with maintenance teams to ensure minimal downtime and efficient
• Health and Safety: Promote a culture of safety within the team by enforcing workplace safety standards and Conduct regular safety audits and risk assessments.
• Reporting and Analysis: Generate detailed reports on production performance, yield, and process Use data to analyze trends and implement corrective actions as needed.

Skills & Experience Required:

• Bachelor's degree in Engineering, Manufacturing, or related.
• Minimum of 5-7 years of experience in semiconductor or electronics manufacturing, with a focus on wire bond and die bond.
• Strong knowledge of lean manufacturing principles and Six Sigma certification is an added benefit.
• Proven experience in managing production teams, with excellent leadership and communication.
• Proficiency in production planning, quality assurance, and equipment maintenance for wire and die bond processes.
• Ability to troubleshoot technical issues and implement effective process.
• Strong analytical and problem-solving.
• Detail-oriented with a commitment to quality.
• Excellent communication and interpersonal skills.
• Proficiency in Microsoft Office and familiarity with ERP.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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