Engineering Manager

Our client is a rapidly expanding Semiconductor company in Malacca. They are currently seeking an Engineering Manager who will oversee the areas of Die Bond, Plating, Dispensing, Testing.


Key Responsibilities:

• Leadership & Team Management: Lead a team of engineers and technicians, fostering a collaborative environment that promotes innovation, problem-solving, and high performance. Mentor and develop team members to reach their full potential.
• Process Optimization: Manage and enhance die bonding, plating, dispensing, and testing processes to improve production efficiency, yield, and product quality. Implement best practices and drive continuous improvement initiatives.
• Quality Assurance: Collaborate closely with the quality team to ensure all processes meet stringent quality standards and regulatory requirements. Identify and address quality issues proactively to maintain a high standard of product reliability.
• Project Management: Plan, organize, and execute projects aimed at process enhancement, cost reduction, and equipment upgrades. Track project milestones, allocate resources, and ensure timely completion within budget.
• Collaboration: Work cross-functionally with R&D, production, and supply chain teams to support product development, resolve technical challenges, and ensure smooth production workflows.
• Data Analysis: Utilize data-driven approaches to monitor production metrics, analyze trends, and identify opportunities for improvement. Ensure that all equipment and processes operate within defined specifications and parameters.
• Troubleshooting & Problem-Solving: Address technical challenges within the die bonding, plating, dispensing, and testing processes swiftly and effectively, providing technical guidance and hands-on support as needed.
• Compliance & Safety: Ensure compliance with company policies, industry standards, and safety regulations in all engineering activities. Promote a culture of safety within the team and address any potential risks.

Skills & Experience Required:

• Bachelor's or Master's degree in Engineering, Electronics, Material Science, or a related field.
• Minimum of 5-7 years of experience in semiconductor manufacturing, with a focus on die bonding, plating, dispensing, and testing processes.
• Proven experience in a leadership role within a manufacturing or engineering environment, preferably in the semiconductor industry.
• Strong understanding of production processes, equipment, and materials used in die bonding, plating, and dispensing.
• Demonstrated ability to lead and motivate a technical team.
• Excellent analytical and problem-solving skills with a data-driven mindset.
• Strong project management skills with the ability to handle multiple priorities and meet deadlines.
• Proficiency in English; knowledge of other languages used in Malaysia (Mandarin proficiency would be an added benefit).

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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