Encapsulation Molding Process Manager

A leading semiconductor manufacturer is seeking an experienced Molding Encapsulation Process Engineering Manager to lead and optimize molding operations across high-volume production lines.


Key Responsibilities:

• Manage and improve molding and encapsulation processes to ensure quality, efficiency, and yield targets.
• Lead troubleshooting, root cause analysis, and implementation of corrective actions.
• Drive continuous improvement initiatives in tooling, materials, and process parameters.
• Collaborate with cross-functional teams on new product introductions and technology transfers.
• Ensure compliance with quality, safety, and operational standards.

Skills & Experience Required:

• Strong expertise in semiconductor molding and encapsulation processes.
• Proven leadership in process engineering within a high-volume manufacturing environment.
• Hands-on experience with troubleshooting, DOE, and statistical analysis tools.
• Excellent communication and cross-functional collaboration skills.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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