Die Bond Development Engineer

This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer.

Key Responsibilities:

• R&D Project Management: Lead and contribute to various R&D projects related to semiconductor packaging, ensuring they are completed on time and within budget.
• Experiment Design: Plan and execute experiments to evaluate and optimize the performance of Soft Solder Die Attach processes and materials.
• Data Analysis: Analyze experimental data and test results to identify trends and areas for improvement.
• Materials Selection: Collaborate with materials scientists and engineers to choose suitable materials for die attach processes.
• Process Optimization: Continuously refine and optimize die attach processes for efficiency and performance.
• Quality Assurance: Ensure that all products and processes meet stringent quality and reliability standards.
• Documentation: Maintain detailed records of experiments, results, and findings to support research and development efforts.
• Cross-Functional Collaboration: Collaborate with cross-functional teams, including design, testing, and production, to transfer successful processes to manufacturing.
• Technical Innovation: Stay updated on industry trends and emerging technologies in semiconductor packaging and apply this knowledge to improve our products.

Skills & Experience Required:

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Materials Science, or a related field.
• Proven experience in Die Bond knowledge within a semiconductor company or related industry.
• Strong knowledge of semiconductor packaging technologies, materials, and manufacturing processes.
• Excellent problem-solving skills and the ability to think critically.
• Proficiency in data analysis tools and software (e.g., MATLAB, Python, or similar).
• Strong communication and teamwork skills, with the ability to collaborate effectively with cross-functional teams.
• Attention to detail and a commitment to quality.
• A self-motivated and innovative mindset with a passion for staying current with industry trends.

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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