Assembly Package Development Engineer

A leading semiconductor company is seeking an experienced Assembly Package Development Engineer to drive the design and development of advanced packaging solutions.

Key Responsibilities:

• Design, develop, and qualify semiconductor packaging solutions based on internal and customer specifications
• Enhance packaging performance, reliability, and manufacturability
• Lead end-to-end packaging projects from concept to mass production
• Collaborate closely with customers and internal teams on packaging requirements
• Investigate and integrate new materials, processes, and packaging technologies
• Optimize existing designs for cost, yield, and efficiency
• Prepare technical documentation and project updates
• Work cross-functionally with engineering, quality, and operations teams

Skills & Experience Required:

• Degree in Engineering or related field (Materials, Mechanical, Electrical, etc.)
• 8-15 years' experience in semiconductor packaging development
• Strong knowledge of packaging technologies (e.g., wire bond, flip chip, QFN, BGA, WLCSP)
• Proven ability to develop and refine packaging designs
• Excellent technical communication and collaboration skills

To apply, please click "APPLY NOW" or email Shan Li at shanli.ong@ambition.com.my. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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